TowerJazz offers a broad range of customizable process technologies including SiGe BiCMOS and RF CMOS (SOI and bulk) for Radio Frequency (RF) and High Performance Analog (HPA) applications targeting high speed consumer devices and high-frequency networking and wireless communications; CMOS Image Sensor (CIS) for consumer, industrial, medical and automotive applications; Bipolar-CMOS-DMOS (BCD) and 700V processes for power management ICs; Mixed-Signal CMOS for digital, analog, RF and automotive applications and MEMS capabilities to address complex wireless and consumer electronics markets.
These modular processes are tailored to meet our customers' precise specifications for the most cost-effective and versatile solutions.
Our process technologies are used to manufacture ICs on either 150mm, 200mm or 300mm wafers in our world-class fabrication facilities which have achieved quality certifications for environmental management, health & safety, information security, and automotive standards.
We also provide a world-class design enablement platform that enables a quick and accurate design cycle.
In addition, TowerJazz provides (TOPS) Transfer Optimization and development Process Services to IDMs and fabless companies that need to expand capacity. We offer multi-fab sourcing with two manufacturing facilities in Israel, one in the U.S., and three in Japan through a joint venture with Panasonic Corporation.