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Jazz Semiconductor offers its customers quick and low-cost
access to high performance processes through a Multiproject Wafer
(MPW) program. The Jazz MPW program provides customers with the
opportunity to prototype their upcoming designs on one of Jazz's
leading-edge technology platforms and provides the customer with
a vehicle to get new designs into the market quickly, without incurring
the full cost of a complete mask set.
Jazz
Semiconductor MPW Schedule
Updated 05/05/08
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Process
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Part No.
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Description
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Tape-In
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Ship Date
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| SBC18 |
A0851
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SiGe BiCMOS 0.18um |
2/19/2008
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5/23/2008
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| SBC35 |
A0796
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SiGe BiCMOS 0.35um |
3/4/2008
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5/19/2008
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| SBC18 |
A0795
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SiGe BiCMOS 0.18um |
3/18/2008
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6/20/2008
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| SBC18 |
A0852
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SiGe BiCMOS 0.18um |
4/15/2008
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7/25/2008
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| BCD25 |
A0794
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Bi-CMOS-DMOS 0.25um |
4/29/2008
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7/11/2008
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| CP05MB-SOI |
A0654
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CMOS 0.50um SOI |
5/6/2008
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7/11/2008
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| CA18 |
A0797
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RFCMOS 0.18um |
5/20/2008
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8/15/2008
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| SBC18 |
A0814
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SiGe BiCMOS 0.18um |
5/27/2008
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8/28/2008
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| SBC35 |
A0842
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SiGe BiCMOS 0.35um |
6/10/2008
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8/25/2008
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| SBC18 |
A0853
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SiGe BiCMOS 0.18um |
6/17/2008
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9/19/2008
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| SBC18 |
A0841
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SiGe
BiCMOS 0.18um |
7/15/2008
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10/17/2008
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| BCD35 |
A0942
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Bi-CMOS-DMOS 0.35um |
7/22/2008
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9/29/2008
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| BCD25 |
A0951
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Bi-CMOS-DMOS 0.25um |
8/5/2008
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10/10/2008
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| SBC18 |
A0854
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SiGe BiCMOS 0.18um |
8/12/2008
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11/14/2008
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| CA18 |
A0840
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RFCMOS 0.18um |
9/16/2008
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12/4/2008
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| SBC18 |
A0864
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SiGe BiCMOS 0.18um |
9/23/2008
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12/30/2008
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| SBC35 |
A0954
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SiGe BiCMOS 0.35um |
9/30/2008
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12/15/2008
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| BCD35 |
A0943
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Bi-CMOS-DMOS
0.35um |
10/7/2008
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12/15/2008
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| SBC18 |
A0950
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SiGe BiCMOS 0.18um |
10/21/2008
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1/23/2009
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If Polyimide is needed, the published
Fab-Out date will be 5 days later
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The MPW program runs on a monthly basis, allowing customers
multiple opportunities to tape-out their designs. Jazz will provide
a customer with a 5x5mm tile for their design (the customer can
purchase multiple tiles) and offers subdicing of the tile for an
incremental charge. The customer receives approximately 50 tiles
upon completion of the MPW.
NOTE: Jazz Semiconductor contracts with third parties for purposes
of performing various wafer processing, including but not limited
to such services as backgrind, bumping, dicing, epitaxy or other
processing steps. Customer agrees that Jazz Semiconductor may release
the MPW wafers to such third party contractors for performance of
such services, provided that such third party contractors are bound
by an obligation of confidentiality no less restrictive than the
terms currently in place between Jazz Semiconductor and Customer
and are also under obligation to return all wafers or wafer remnants
to Jazz Semiconductor upon completion of its services.
Dates are subject to change without notice - a purchase order needs
to be placed and accepted to guarantee a particular tape-in date.

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