Jazz Semiconductor offers its customers quick and low-cost access to high performance processes through a Multiproject Wafer (MPW) program. The Jazz MPW program provides customers with the opportunity to prototype their upcoming designs on one of Jazz's leading-edge technology platforms and provides the customer with a vehicle to get new designs into the market quickly, without incurring the full cost of a complete mask set.

Jazz Semiconductor MPW Schedule

The MPW program runs on a monthly basis, allowing customers multiple opportunities to tape-out their designs. Jazz will provide a customer with a 5x5mm tile for their design (the customer can purchase multiple tiles) and offers subdicing of the tile for an incremental charge. The customer receives approximately 50 tiles upon completion of the MPW.

NOTE: Jazz Semiconductor contracts with third parties for purposes of performing various wafer processing, including but not limited to such services as backgrind, bumping, dicing, epitaxy or other processing steps. Customer agrees that Jazz Semiconductor may release the MPW wafers to such third party contractors for performance of such services, provided that such third party contractors are bound by an obligation of confidentiality no less restrictive than the terms currently in place between Jazz Semiconductor and Customer and are also under obligation to return all wafers or wafer remnants to Jazz Semiconductor upon completion of its services.

Dates are subject to change without notice - a purchase order needs to be placed and accepted to guarantee a particular tape-in date.

For Shuttles at Tower
0.18um ship dates: *TSL shipment due dates are based on 4LM base process. *For each additional photo-mask step, add ~1.5 days. *CIS process due dates depend on specific process complexity.
0.13um due dates are based on 5LM base process.