|
WISPRY AND JAZZ SEMICONDUCTOR PARTNER TO CREATE
RF-MEMS FOR USE IN CELLULAR HANDSETS AND MOBILE COMMUNICATIONS DEVICES
WiSpry Innovative RF-MEMS Program Leverages Jazz Leading-Edge
RF-CMOS Process Knowledge and 200mm Fabrication Facilities to Accelerate
Availability of MEMS
IRVINE and NEWPORT BEACH, Calif., December 2, 2005 --
WiSpry, Inc., developer of low-cost, high-performance radio frequency
micro-electro-mechanical systems (RF-MEMS) tunable components and
modules for the wireless industry, and Jazz Semiconductor, an independent
wafer foundry focused on specialty complementary metal oxide semiconductor
(CMOS) process technologies, today announced that they have partnered
to create innovative RF-MEMS offerings using Jazz's leading-edge
RF-CMOS processes. The program has successfully demonstrated the
feasibility of commercially manufacturing WiSpry's digitally tunable
capacitor devices into Jazz Semiconductor's 200mm wafer fab and
provides commercial availability of highly integrated RF-MEMS devices,
built upon Jazz's leading-edge processes.
"WiSpry believes that RF-MEMS devices will be a disruptive
element in the design of future RF systems," said Jeff Hilbert,
president and CEO, WiSpry, Inc. "However, as with all components
in the mobile domain, requirements such as price, power and performance
are key. Our success in bringing this exciting technology to market
depends on our ability to leverage existing semiconductor processes,
permitting us to drive down cost and successively increase integration
with other RF technologies. To that end, we are delighted to be
able to develop this strategic relationship with Jazz, whom we view
as one of the leading foundries in the RF semiconductor space. We
believe this relationship places the two companies at the forefront
of RF innovation."
The companies plan to integrate RF-MEMS digital capacitors and other
functions into active silicon circuitry, enabling a roadmap to higher
levels of integration with RF circuitry such as low noise amplifiers
(LNAs), power amplifiers (PAs), and transceiver technology. Solving
one of the key barriers to leveraging standard low-cost RF packaging
techniques, the companies are co-developing techniques for commercial
wafer level sealing of RF-MEMS devices. Wafer level sealing is one
of the key components necessary to provide low-cost, high volume
commercial RF-MEMS products.
"RF-MEMS is a relatively new area for foundry semiconductor
development and we are excited at the prospect of bringing this
technology to market in a commercial process," said Paul Kempf,
chief technology and strategy officer, Jazz Semiconductor. "Our
partnership with WiSpry will help enable innovative tunable MEMS
process and device technologies, complementing the range of leading
edge, high volume RF technologies at Jazz. Integrated RF-MEMS enabled
tunable solutions address the needs of the rapidly growing cellular
handset and mobile communications markets."
About Micro-Electro-Mechanical Systems (MEMS)
MEMS use microscopic moving structures that are thousandths of an
inch in size. Built using silicon chip manufacturing technologies,
MEMS devices have found widespread application in airbag sensors,
accelerometers, micro-optics, video projection systems and printer
heads, and are now finding application in RF systems.
MEMS is an enabling technology that promises to revolutionize RF
components by bringing together silicon-based micro-electronics
with micro-machining technology, making possible the realization
of complete systems-on-a-chip solutions. Unlike compound semiconductor
devices, RF-MEMS-based devices can reduce space and cost while simultaneously
achieving a combination of high isolation and low insertion loss
that is simply unachievable with conventional silicon technology.
The integration of RF-MEMS devices with transceivers, power amplifiers
and other active semiconductor circuits promises to open a new range
of possibilities for RF devices, reducing size, cost and power consumption
while increasing functionality for multimode and multi-standard
transceiver designs.
About WiSpry
WiSpry, headquartered in Irvine, Calif., designs and markets
hardware components and modules to radio frequency (RF) system manufacturers
of voice and data communications and acquisition products. Utilizing
the Company's core competency in radio frequency micro-electro-mechanical
systems (RF-MEMS) technology, WiSpry's products enable system designers
to achieve the architectural innovation required for the growing
diversity of mobile and fixed electronic applications and networks.
Principle investors of WiSpry include Blueprint Ventures, American
River Ventures, Sid R. Bass Associates, Shepherd Ventures, In-Q-Tel
and Tech Coast Angels. For more information, visit www.WiSpry.com.
WiSpry Media Contact
Lisa Porter
949/752-5891
lporter@portercreative.com
About Jazz Semiconductor
Jazz Semiconductor is an independent wafer foundry focused primarily
on specialty CMOS process technologies, including SiGe BiCMOS and
RFCMOS for the manufacture of highly integrated analog and mixed-signal
semiconductor devices. Jazz’s executive offices and its U.S.
wafer fabrication facilities are located in Newport Beach, California.
Jazz has expanded its wafer capacity in China through manufacturing
partnerships with Advanced Semiconductor Manufacturing Corporation
and Hua Hong NEC Electronics Co., Ltd. Contact Jazz Semiconductor
at www.jazzsemi.com.
Jazz Company Contact
Jessica McNaughton
949/435-8086
jessica.mcnaughton@jazzsemi.com
Jazz Media Contact
Lauri Julian
949/715-3049
l.julian@earthlink.net
|
