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JAZZ SEMICONDUCTOR DELIVERS NEXT GENERATION 0.13
MICRON PROCESS PLATFORM FOCUSED ON ADVANCED ANALOG AND RF SYSTEMS
ON CHIP
Jazz Process Combines Perfect Balance of Cost and
Performance with 0.13 micron Front-End and Aluminum Based Back-End
NEWPORT BEACH AND SAN JOSE, Calif., October 5, 2005
-- Jazz Semiconductor, an independent semiconductor wafer foundry,
today announced at the 2005 FSA Conference, the availability of
process design kits for its 0.13 micron RFCMOS process, CA13, an
innovative approach to enabling analog system on chip integration.
The Jazz 0.13 micron process platform is a low cost alternative
for applications that do not require the expensive copper interconnect
of traditional 0.13 micron CMOS implementations for the back-end
and pairs low power digital logic with high performance analog and
RF circuitry.
Jazz has focused on enabling the integration of key analog and
RF functions by using an aluminum metal interconnect scheme to deliver
the same RF performance and low power consumption of conventional
0.13 micron technology while maintaining the lower cost and reduced
complexity of the familiar aluminum based approach without requiring
expensive copper (Cu) interconnect layers. The Jazz platform is
further differentiated by the addition of a triple well for RF isolation,
5.6fF/µm2 MIM capacitors, varactors, low and high value precision
resistors, and thick metal inductors for improved RF and analog
performance.
The CA13 platform reuses key modules from Jazz's 0.35µm and
0.18µm platforms, provides six layers of metal, and can include
high performance modules such as SiGe NPNs, Vertical PNPs, High
Voltage FETs and non-volatile memory. Designers can use the Jazz
0.13 micron process platform to integrate more high density digital
content with existing products in parallel with scaling the analog
portion of the chip at 0.35µm, 0.25µm or 0.18µm
process nodes. The CA13 platform is the company's third generation
of modular process technology, which allows circuit designers the
flexibility to choose which process features will best differentiate
their products by optimizing design performance, manufacturing cycle
time, and ultimately, cost.
The rollout of the CA13 platform precedes the release of the Jazz
SBC13 Silicon Germanium (SiGe) BiCMOS technology that is based upon
the RFCMOS process. The SBC13 technology includes a low cost, 4
mask, SiGe bipolar NPN to combine all of the features of CA13 with
the performance advantages of SiGe at low additional complexity.
Design kits for SBC13 will be available in the first quarter of
2006.
"RF System on Chip integration for low cost wireless is a critical
component of the growing portable and connected electronics markets.
Jazz Semiconductor's 0.13 micron process platform provides an efficient
option, enabling RF System on Chip integration," said Joanne
Itow, managing director, Semico Research. "The follow-on 0.13
micron SiGe version will further enable circuit designers to achieve
higher levels of integration at higher speeds."
The Jazz 0.13 micron process technology is targeted for markets
including multi-standard TV tuners and integrated demodulators,
cellular and wireless LAN transceivers with digital power control
integration and virtually any other design requiring RF or analog
System on Chip integration.
"With our 0.13 micron process platform, we are serving analog
and RF companies that have an increasing need for low power digital
integration with high performance analog and RF circuitry,"
said Paul Kempf, chief technology and strategy officer, Jazz Semiconductor.
"The CA13 process and its follow on SiGe BiCMOS version, SBC13,
continue to underscore our commitment to enable low cost, highly
integrated analog and RF ICs for next generation products."
About Jazz Semiconductor
Jazz Semiconductor is an independent wafer foundry focused primarily
on specialty CMOS process technologies, including SiGe BiCMOS and
RFCMOS for the manufacture of highly integrated analog and mixed-signal
semiconductor devices. Jazz’s executive offices and its U.S.
wafer fabrication facilities are located in Newport Beach, California.
Jazz has expanded its wafer capacity in China through manufacturing
partnerships with Advanced Semiconductor Manufacturing Corporation
and Hua Hong NEC Electronics Co., Ltd. Contact Jazz Semiconductor
at www.jazzsemi.com.
Jazz Company Contact
Jessica McNaughton
949/435-8086
jessica.mcnaughton@jazzsemi.com
Jazz Media Contact
Lauri Julian
Lages & Associates
949/715-3049
lauri@lages.com
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