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Jazz Announces 0.25-micron BCD Process for Power
Management and High Voltage Applications
12/7/2006
Jazz announced the availability of its 0.25-micron Bipolar CMOS
DMOS (BCD25) processes targeted for the emerging power management
and high voltage markets. The Jazz 0.25-micron offering provides
a migration path from its industry proven 0.5-micron, 40V BCD process.
Jazz BCD25 enables reduction in power consumption, allows significant
shrink in the size of power drivers (up to 50% compared with BCD05)
and provides a low-cost solution for power applications.
"The increase in power management at the system level has
created a unique opportunity for foundries in the analog space to
expand their specialty processes," said Joanne Itow, managing
director, Semico Research. "Jazz Semiconductor's extension
of its specialty offerings from SiGe and RFCMOS for RF, to BCD for
power management, underscores their commitment to the specialty
foundry model."

Mobile TV Comes of Age
11/27/2006
For mobile broadcast TV, Mirics Semiconductor has developed a reconfigurable
radio chip that can handle all the mobile TV formats in the world.
The multi-standard TV tuner, MSI001 is initially aimed at consumer
digital DAB + FM radio receivers and video on mobile phones. The
BiCMOS chip is being made by Jazz Semiconductor in a 0.35-micron
process.

Jazz and Mirics Partner to Deliver Poly-Band Tuner
11/16/2006
Mirics Semiconductor has partnered with Jazz Semiconductor to deliver
its device, the MSI001 poly-band tuner for mobile digital broadcast
reception, currently available. Mirics designed its product using
Jazz Semiconductor's high-volume silicon germanium BiCMOS (SiGe
BiCMOS) process to develop a high performance, low power consumption
mobile broadcast receiver. Mirics technology enables OEMs to design
a single platform for mobile TV and radio, independent of standards
or regional differences.

A Poly-Band Tuner for Mobile Broadcast Reception
11/12/2006
Mirics Semiconductor and Jazz Semiconductor deliver the MSI001,
a universal broadcast receiver that enables designers of mobile
phones, portable media players, and PDAs to easily add mobile broadcast
reception to support any global standard. Samples of the MSI001,
manufactured in the first quarter of this year, were based on silicon
from Jazz. By leveraging SBC35, Jazz Semiconductor's 0.35-micron
SiGe BiCMOS process platform, and utilizing its sophisticated analog
and RF design flow and modeling infrastructure, Mirics engineers
were able to achieve results and achieve functional, first-pass
silicon.

Jazz Announces PSP Support for RF Circuit Simulation
10/27/2006
Jazz Semiconductor announced full support for PSP, an advanced surface
potential based MOSFET model, in its 0.18-micron RFCMOS and SiGe
BiCMOS technologies. The PSP model was approved and released by
the Compact Model Council in June 2006 as the next generation industry
standard MOSFET model. The model provides several critical advances
in MOSFET modeling such as improved RF noise modeling and high order
derivative accuracy around the Vds=0 point, where many key RF circuits
operate. The Jazz 0.18-micron PSP model library provides a complete
solution including RF, noise, corner, mismatch and statistical models.

Old Buddies Reunite in Hopes of Taking Tech World
by Storm... Again
10/17/2006
Gil Amelio (Chairman & CEO of Acquicor Technology Inc.) talked
through his theory about how three major trends are driving technology.
One is convergence of computing, communication and media; two is
wireless; and three is consumer electronics moving to high-definition
digital, particularly TV, he said.
"We wanted to buy a company that addressed these markets -
that would go right to the epicenter of these trends," Amelio
says. Jazz makes advanced chips and is known for building radio
transmitters into superfast Silicon Germanium chips, which could
go into tinier, more powerful cellphones and other wireless media
products.
"We finally converged on Jazz Semiconductor," Amelio says,
implying a long search. "Look at where its products go - right
into the heart of the trend. We think it's a company in transition.
It gives us a platform where we can apply our management skills
and experience and create shareholder value."

Take the M&A Train
10/9/2006
Jazz Semicondcutor may yet hit that high note. The announcement
last month that Acquicor Technology Inc. would purchase the Newport
Beach, Calif., specialty wafer maker for $260 million marks the
end of a long and winding road for Jazz and perhaps the beginning
of another.
Jazz has progressed far since Conexant spun it out as a captive,
one-customer chipmaking plant. In the past four years, it has attracted
nearly 100 customers with its analog and mixed-signal manufacturing
processes, a specialty that cannot be claimed by many of its larger
Asian competitors.

Jazz Gears Up for Annual Technology Conference
10/9/2006
Jazz Semiconductor will host its Annual Technology Conference on
Friday, November 3. Jazz will highlight its analog foundry model
and its design kit and modeling features that enable advanced analog
integration for next generation wireless, power management, high
speed networking and data storage products. Jazz technology offerings
include High Voltage CMOS, Bipolar-CMOS-DMOS (BCD), RFCMOS and SiGe
BiCMOS processes for the manufacture of highly integrated analog
systems-on-chip (SoCs), a concept often relegated to the digital
realm, but now becoming more mainstream with the trends towards
convergence in consumer and wireless products.

September 26, 2006 -- Acquicor Technology Inc., a company
formed by Apple Computer Inc. veterans, agreed to acquire closely
held Jazz Semiconductor Inc. in a transaction valued at $260 million.
Acquicor, whose backers include former Apple CEO Gil Amelio and
co-founder Steve Wozniak, was recently formed with the goal of acquiring
technology companies. It raised more than $170 million earlier this
year in an initial public offering.
Following the transaction, Jazz will become a subsidiary of Acquicor.
Shu Li, the chief executive of Jazz since 2002, will continue in
that role. Mr. Amelio will remain Chairman and CEO of the parent
company.

Acquicor Technology Inc. said it agreed to acquire Jazz Semiconductor
for $260 million. The Newport Beach, Calif., acquisition company
expects to complete the merger in the first quarter, and will merge
Jazz with an Acquicor unit.
Jazz, a privately held specialty wafer manufacturer will no longer
pursue an initial public offering and will withdraw its registration
statement with the Securities and Exchange Commission.
Shu Li will continue as chief executive officer of Jazz and will
be supported by the Jazz management team.
Jazz was formed in 2002 as a joint venture between Conexant Systems
Inc. and private equity firm Carlyle Group.

Acquicor Technology, an investment firm created by former Apple
Computer executives, is spending $260 million to buy Jazz Semiconductor,
a contract chip maker with specialized manufacturing technologies.
Jazz Semiconductor's specialty is to make semiconductors that require
less common materials and technologies-those chips are analog or
mixed-signal chips in cell phones, wireless networking equipment,
and consumer electronics such as game consoles.
The majority of the chips made in the world today, including the
microprocessors that power computers and servers, are digital and
use CMOS (complementary metal oxide semiconductor). Many chip designers
strive to develop chips that can be made in CMOS because the material,
silicon, and the manufacturing cost are cheaper. But Acquicor executives
told analysts during a conference call Wednesday that the explosion
of gadgets and wireless networks and home and office use will fuel
more designs for chips that require Jazz's foundry expertise. Jazz's
technologies include the use of silicon germanium.

Paradoxically, RF integration may be SiGe's best
friend
9/18/06
by Ron Wilson, Executive Editor
Several recent trends have some process developers and chip designers
arguing that SiGe is not a legacy technology but an increasingly
attractive option. Marco Racanelli, VP of technology at Jazz points
out that in effect, heavily strain-engineered bulk CMOS processes
have become as complex as SiGe processes. "But they are only
getting the advantage of increased strain on the active region to
improve mobility," Racanelli observes. "With a full SiGe
process, you get this benefit, but you also get the important bandgap
difference from Germanium, and you get bipolar transistors."
In addition, SiGe can deliver its higher power-carrying potential,
better linearity, and better noise characteristics in a legacy process
(as well as) system cost and risk/time-to-market advantages over
a fully silicon CMOS solution.

Cadence Overhauls Custom IC Design Platform
9/11/06
Jazz collaborated with Cadence to deliver a process design kit
(PDK) for the new Virtuoso platform for its latest 0.13-micron process
which, together with Jazz silicon-accurate models, are expected
to allow common customers to use the new capabilities needed to
realize full design potential and quick time to market.

Jazz First Semiconductor to Achieve Information
Security Standard
9/6/06
Jazz announced that it is the first semiconductor company in the
U.S. to achieve certification to ISO/IEC 27001:2005, the new global
information security standard. Attainment of ISO 27001 certification
is only awarded to companies that can demonstrate high levels of
competency in information security management. Jazz achieved ISO
27001 certification in five months. To date, there are only eleven
other organizations nationwide that have achieved the new standard
and Jazz is the only U.S. semiconductor company.

Mentor, Jazz Semi release design kits
9/5/06
Jazz and Mentor Graphics announced the availability of a series
of technology design kits supporting Jazz's SiGe and CMOS process
technologies. The first set of kits, available immediately, support
Jazz's 0.35-micron silicon BiCMOS process, its 0.18-micron silicon
BiCMOS process and its 0.18-micron CMOS process. The kits enable
IC design companies to set up their design environments using Mentor's
analog/mixed-signal SoC design flow.
True Poly-Band Tuner Resolves Fragmentation Problem
with Mobile Broadcast Standards
7/20/06
by Ashok Bindra
To overcome the fragmentation of the mobile broadcast receiver
market, Mirics Semiconductor has readied a poly-band tuner for mobile
digital broadcast reception. It enables designers of mobile phones,
portable media players and PDAs to easily add mobile broadcast reception
to support any global standard. Labeled MSI001, it offers low power
consumption and high performance at a low cost.
According to Mirics, the 0.35µm SiGe BiCMOS-based MSI001
chip (manufactured by Jazz Semiconductor) is capable of receiving
all broadcast standards announced to date, including DVB-H, T-DMB,
ISDB-T, DAB-IP, MediaFlo, DAB, DRM and even AM/FM. Mirics also designed
the MSI001 to be configured for the reception of other standards,
or unknown future standards, without any cost or performance penalty.

Jazz Semiconductor to Produce MEMS Resonators
for SiTime
7/11/06
SiTime and Jazz have partnered to bring SiTime's MEMS First
silicon mechanical oscillator products to market at Jazz's 200mm
wafer foundry. The MEMS First products are designed to replace
traditional quartz oscillators and can be fabricated using manufacturing
techniques and equipment that exist in the silicon semiconductor
industry today. This capability will allow industrial scaling of
MEMS in a foundry environment.
"Jazz is well-suited to be our manufacturing partner as it
is an established specialty foundry that offers the technology and
customer focus that can help us realize our vision of beginning
to transform the timing industry through MEMS solutions," said
Kurt Petersen, CEO and co-founder of SiTime. "In addition,
their impressive technical expertise in production silicon processes
helps assure that SiTime will have the tools to create innovative
products."

Mated to 0.13µm CMOS, Foundry's SiGe NPNs
Match RFCMOS for Less Cost
7/6/06
How does an analog foundry reduce power consumption in an RF mixed-signal
process while accommodating for the differences in scalability between
logic and analog circuit elements? Jazz plans to do it with a 0.13µm
silicon-germanium (SiGe) BiCMOS technology that combines 90-GHz
SiGe transistors with the company's existing 1.2-V, 0.13µm
digital CMOS platform.
A 2.8µm-thick top metal layer boosts inductor performance.
Also part of the new SBL13 process geometry is a stacked 5.6-fF/µm2
metal-insulator-metal capacitor that lets designers aggressively
scale the capacitance area. Late last month, Jazz began offering
process design kits for SBL13.

Jazz Introduces 0.13 Micron SiGe BiCMOS Process
for RF Design
6/20/06
Jazz continues to expand its specialty process offerings that promote
high voltage and high levels of integration. The latest addition
is the SBL13 platform, created to address the growing need for a
RF process that incorporates bipolar devices for better noise and
frequency performance. The SBL13 SiGe bipolar device is a silicon
germanium transistor added to an aluminum-based 0.13µm CMOS
process with minimal additional masks. The combination results in
a process that is comparable in mask count to an industry standard
0.13µm RFCMOS process which typically also requires a more
costly copper metallization scheme. In addition to the bipolar,
the process includes a stacked MIM capacitor for scaling of capacitance
area and a thick top metal for inductor performance.


Jazz Introduces 0.13 Micron SiGe BiCMOS Process
for RF Design
6/15/06
"We continue to build out our SiGe roadmap by listening to
our customers, understanding end applications, and using our modular
infrastructure to develop the right combination of process features
to address the demands of those applications," said Marco Racanelli,
vice president of technology and engineering, Jazz Semiconductor.
"Our SBL13 offering is designed to provide the low-power and
high-performance attributes of the 0.13 micron node without the
high cost typically associated with it by incorporating an aluminum
back-end as well as a very streamlined architecture for the bipolar
device. The process can thus be used not only to provide power,
noise and performance advantages but can also be adopted in more
cost sensitive segments of the market."

Foundry offers 0.13 micron SiGe BiCMOS process
for high performance RF design
6/14/06
Jazz announced the availability of process design kits for its
SBL13 process, a 0.13µm silicon germanium (SiGe) BiCMOS technology
combining high performance, low cost SiGe transistors with its low-power
(1.2 V), 0.13µm digital CMOS platform, CA13. The process also
includes a suite of high-density passive elements for more aggressive
scaling of analog device area in complex analog system-on-a-chip
(Analog SoC). The Jazz SBL13 process technology enables the design
of cost-effective and highly integrated circuits for most wireless
applications that require the combination of dense digital logic
with high performance RF and analog functionality. Examples of products
that can take advantage of the SBL13 process include mobile TV tuners,
cellular transceivers and WLAN transceivers.

Foundry offers modeling tool for analog, RF customers
6/2/06
by Dylan McGrath
Jazz Semiconductor has made available a Process Control Model Tool
(PCMT) to customers through the company's eBizz Web interface. The
PCMT allows designers to close the loop between simulated results
from silicon models and actual results for product designs at the
lot, wafer, or die level. The PCMT allows designers to correlate
wafer measurements to simulations, serving as a tool for design
optimization and cycle time reduction.
"Jazz strives to deliver modeling platforms that enable our
customers to successfully design for manufacturability. With PCMT,
we have augmented our statistical modeling platform with an automated
and direct feedback mechanism for our customers, closing the loop
between design to specification and silicon performance," said
Dr. James Victory, RF Modeling and Characterization Manager at Jazz.

RF MEMS Integrates CMOS Controller
By partnering with an established semiconductor foundry, a developer
of MEMS switches has found a practical path to integrating MEMS
with CMOS devices.
June 2006
by Refugio L. Jones, Michael C. Hopkins
To realize a practical path to MEMS integration, WiSpry has partnered
with Jazz to develop the first MEMS device with an integrated CMOS
controller. The resulting active CMOS controller is a multifunction
IC with the capability of converting 3 V or less to the high voltages
needed to control WiSpry's electrostatic RF MEMS switch. The controller
includes a charge pump, high-voltage switches to multiplex or steer
the high voltages from the charge pump to the MEMS, and digital
CMOS processor.
The active circuitry for the MEMS CMOS integrated controller resides
beneath the MEMS switches. Jazz developed a process that allows
this physical integration without noise and spurious coupling from
the on-chip active circuitry. This " coupling immunity"
allows for the construction of on-chip RF structures, which previously
could not be integrated into a cellular telephone.


Jazz Semi Declares Nasdaq Float
4/24/06
by Alex Mayhew-Smith -- Electronics Weekly
Jazz Semiconductor (declares) float on the Nasdaq stock exchange,
for a maximum of $105 million. The SiGe and BiCMOS specialty foundry
was originally part of Conexant Systems.
Jazz recently begun shipping volume production of its CP05 technology
targeted at the power control and power management markets. It marked
the company's move into the growing power management sector with
CP05 by combining a 0.5micron front-end with a 0.25micron back-end
metallization to achieve very low on-resistance devices in a low
cost power management platform. The platform is targeted to the
wireless and consumer application markets.

Jazz Semi Relaunches IPO Effort
4/24/06
by Dr. Mike Cooke
Jazz Semiconductor has reinitiated initial public offering efforts
of as much as $105 million in common stock. A preliminary filing
for the new offering made with the SEC reports that Cowen &
Co., Needham & Co. LLC and Wachovia Securities have been hired
to underwrite the IPO. Majority stakes are currently held by a group
consisting of private equity firm Carlyle Group, microchip maker
RF Micro and communications and network chips maker Conexant Systems
(itself spun out of Rockwell).
Jazz Semiconductor is a pure-play semiconductor wafer foundry providing
RF and mixed-signal process technologies. In March, the company
announced that it is shipping volume production of its CP05 (power
CMOS process) technology targeted at power control and power management
markets.

Jazz Semiconductor files for $105 million IPO
WASHINGTON, April 24 - Jazz Semiconductor Inc. on Monday
said it is planning an initial public offering of as much as $105
million in common stock. The company hired Cowen & Co., Needham
& Co. LLC and Wachovia Securities to underwrite the IPO, according
to a preliminary offering filing with the U.S. Securities and Exchange
Commission. The company is seeking a Nasdaq listing under the symbol
"JAZZ."

March 2006 What's Hot: High-Voltage BCD
Process
Jazz Semiconductor announces its 0.5µm BCD process technology
targeted at power-management ICs and high performance amplifiers
and drivers required for consumer applications. The Jazz BCD process
is a 40V BCD process that features dual-gate oxides (5.5 and 16V),
complementary N- and P-channel MOSFETs with 5, 7, 16, and 30V capabilities,
vertical NPN (VNPN) and lateral PNP (LPNP) bipolar transistors,
a variety of passive elements and an NMOS device rated for 40V operation.
This process provides a versatile platform for applications requiring
BiCMOS or BCD-only process technologies and integrates 0.5µm
CMOS with high-voltage drivers, enabling the fabrication of complex
smart-power chips.
Jazz Rolls Power-Management Process
3/15/06
by Mark LaPedus
Jazz Semiconductor Inc. has begun shipping a CMOS-based foundry
process for power control and management applications. Jazz is addressing
the growing power management sector with the CP05 process. The technology
combines a 0.5-micron front-end with a 0.25-micron back-end metallization
to enable low, on-resistance devices in wireless and consumer applications.
The CP05 platform is a three-metal process, with 3-micron thick
power metal technology. It offers 5V FETS with low on-resistance
of 4.1 mohm-mm2 and 10.3 mohm-mm2 for n- and p-channel devices,
respectively.
"The CP05 process meets the low Rdson per unit area requirement
of many power applications and has already hit the market in volume
production," said Marco Racanelli, vice president of technology
and engineering at Jazz, in a statement.

Jazz Starts Volume Production of Power Process
3/15/06
Boutique foundry Jazz Semiconductor has begun shipping volume production
of its CP05 technology targeted at the power control and power management
markets. The milestone follows the company's move into the growing
power management sector with CP05 by combining a 0.5-micron front-end
with a 0.25-micron back-end metallization to achieve very low on-resistance
devices in a low cost power management platform. The platform is
targeted to the wireless and consumer application markets.

Growing Power Management Market Forces Designers
to Find Foundry Processes Tailored for System Power Management and
Power Control
3/15/06
Jazz is shipping volume production of its CP05 technology targeted
at power control and power management markets. The CP05 platform
is a three metal process, with a 3um thick power metal and 1 or
2fF MIM caps. It offers 5V FETS with low on-resistance of 4.1 mohm-mm2
and 10.3 mohm-mm2 for N- and P-channel devices respectively to achieve
high power transistors occupying very small die sizes for use in
low-dropout regulators, amplifiers, drivers and other power management
functions.
In addition, by leveraging a cost-effective, mainstream CMOS back-end
in 0.25um, designers can take advantage of more aggressive digital
integration, digital content and more dense routing capability of
the gates (more gates per unit area) than a standard 0.5um CMOS
offering.

Jazz Semiconductor Announces Volume Production
for Power CMOS Processes
3/15/06
"The Jazz CP05 (CMOS) process meets the low Rdson per unit
area requirement of many power applications and has already hit
the market in volume production," said Marco Racanelli, Jazz
VP of Technology and Engineering. "The CP05 offering complements
our 0.5-µm BCD, 0.35-µm BCD, and 0.18/0.25-µm
HVCMOS process offerings which together provide a complete suite
of analog power technology for our customers."
Analog SoCs: Digital's New Counterpart
2/27/06
by Paul Kempf
From the evolution of digital SoCs, one can infer the roadmap
for analog SoCs. In the first stage of migration to digital SoCs,
certain products became integrated functions (SRAM, bus interfaces,
DSPs), many of which are now available as reusable IP blocks. As
part of the analog SoC trend, we expect the same for standard analog
functions including regulators, battery charges and interface ICs,
as they become part of a single-chip analog subsystem.
CLICK here
for PDF (17 KB)
TechnoConcepts chooses Jazz for foundry service
1/26/06
TechnoConcepts has selected Jazz Semiconductor to fabricate
its True Software Radio (TSR) chips. "Jazz currently offers
successive generations of its SiGe BiCMOS process, which supports
the features that will facilitate TechnoConcepts' innovative designs
as we focus on capturing market share in our next-generation products,"
said Turgeon. "Specifically, we will see significant power
savings using the Jazz process since 95% of the chip will be fabricated
in low-power CMOS and only 5% will utilize the high-performance
SiGe, both available on the Jazz SiGe BiCMOS platform process."
TechnoConcept Picks Jazz as Foundry Partner
1/26/06
"Jazz is pleased to partner with companies such as TechnoConcepts
in introducing innovative products like True Software Radio,"
said Marco Racanelli, VP of technology and engineering, Jazz Semiconductor.
"Our process platforms are customizable and can be optimized
to leverage the power efficiencies of low power CMOS while enjoying
the benefits of high speed, low noise SiGe in a single process technology.
These features have been utilized by TechnoConcepts to improve the
way wireless signals are transmitted, received and processed."
Phyworks, Jazz to Develop Advanced Physical Layer
Products
1/17/06
Jazz Semiconductor and Phyworks have partnered to develop physical
layer products for WAN, LAN, SAN and FTTH applications. Phyworks
chose Jazz Semiconductor's 0.35 and 0.18 micron Silicon Germanium
(SiGe) BiCMOS processes to design its networking portfolio of ICs,
including transimpedance amps (TIAs) and integrated laser drivers
and limiting amplifiers.
2005 Editors' Choice Awards; Embedded Control
Module optimizes analog circuit design; Vertical PNP Module by Jazz
Semiconductor
1/1/06
Pushing beyond the capability of standard CMOS (complementary metal-oxide
semiconductor)-based analog circuit design, Jazz Semiconductor has
made available a 17 GHz Vertical PNP (VPNP) module on its 0.18-micron
RFCMOS platform. The new module advances analog circuit design especially
for high voltage, complementary drive, or amplification requirements.
The VPNP module reportedly enables greater integration than currently
available with existing CMOS, RFCMOS, and BiCMOS products.


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